Process Control in IC Manufacturing with Thermal Waves

摘要

In today’s semiconductor market, manufacturers face a daunting challenge. Product concepts evolve rapidly in response to rapidly changing markets while design rules, i.e., device geometries, become increasingly smaller and wafers become larger. Devices must run faster, reliability must improve and the resultant increasing complexity in IC design and fabrication technology intensifies the need for tighter controls of process variables. To compete effectively in this market, manufacturers must improve both product development and product manufacturing processes.